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M.G. Chemicals designed its no clean Lead-Free Solder with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to and exceed the impurity requirements of J-Std-006 and all other relevant international standards such as RoHS. * Exceeds the impurity requirements of J-Std-006 * 21 Gauge, 0.032 “ diameters * Hard non-conductive residues M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%. A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0.Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications. (please look at our rules and privacy policy) |
melinda_ware@modularparts.com (Melinda Ware) for more information. This email will be sent to Melinda Ware' actual email address.
